This FEI Dual Beam 835 is equipped to take up to full 200mm wafers as well as chip pieces. Has an operating voltage of 500V to 30kV and is equipped with a Magnum column. Has a fully motorized rotary tilt stage that is capable of angles ranging from -5 to 55 degrees. Equipped with Search mode and Ultra High Resolution Mode as well as Gas Injection using Platinum, Delineation Etch, and XeF2 Etch. This instrument is working and in good condition at our facility.